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ASM Pacific Technology Ltd (0522.HK) — chart, structure and Closelooknet read

The Closelooknet read

ASMPT designs and builds machines used to assemble semiconductor and electronics packages. It runs two segments: Semiconductor Solutions, covering advanced packaging steps such as hybrid bonding, thermo-compression bonding and wire bonding, plus equipment for CMOS image sensors; and Surface Mount Technology Solutions, covering the printing, inspection and placement tools used to build circuit boards.

Detail below: the desk's view, the earnings record, peers and the company snapshot; daily prices on the price-history tab. Agents can buy the score depth per call over HTTP 402 — see the catalogue. Research diary readings, not advice.

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Signals for this name

Every Closelooknet reading that exists for 0522.HK, from the same nightly bakes the boards use. Research diary readings, not advice.

Versus its index Rubin Build-Out 100 — the name, its sleeve and the index over day, week and month

Versus its index

The name against its Closelooknet index and its own sleeve — equal-weight, nightly closes.

Rubin Build-Out 100 · as of 2026-11-06

DayWeekMonth3 months
0522.HK−7.0%−10.6%−46.2%−41.9%
Advanced Packaging & Bonding−1.0%−9.8%−29.3%—
Rubin Build-Out 100+0.8%−13.2%−28.8%—

Against the index: 2.6 pts ahead on the week, 17.4 pts behind on the month; against its Advanced Packaging & Bonding sleeve 16.9 pts behind on the month.

Returns from the index workers’ nightly closes; equal-weight sleeves. A relative reading from the research diary, not advice.

Mentioned on Closelooknet 2 pieces · newest: Morning 10, “Asia’s chip rally fades into the close: Kospi touches 7,171 and ends under 7,000, Nikkei −1.2% on a 153 yen — and Lenovo drops 6%, Z.ai 10% in Hong Kong” (2026-09-08)

Mentioned on Closelooknet

Where 0522.HK appears in the diary — 2 pieces, newest first. Every link is our own writing.

Dailies

Weather around the name 3 macro readings: Money Temperature, Factor regime, Sovereign pressure

The weather around this name

Macro readings that apply by membership — the regime, the factor tape, the sector cell, the funding backdrop.

  • Money Temperature Composite 47/100 · S&P 500 fund at 48, above its 200-day averageEight instruments scored on position, momentum, volume, volatility and fragility — the regime every name trades inside. Temperature lab → 2026-11-06
  • Factor regime Defensive rotation — low-vol leading, regime-change watchMomentum against low volatility (SPMO / SPLV): below its 50-day trend, 60th percentile of the window, -22.8% over 20 sessions. Factor regime → 2026-11-06
  • Sovereign pressure Index -1.91 · down 2.45 over 21 sessionsG7 long-end yields, 10s30s and the slope — the funding weather for every balance sheet on this site. Sovereign pressure → 2026-11-06
Who it is priced against Rubin Build-Out 100 · Advanced Packaging & Bonding · 5 names with week and year-to-date

Peer group

Rubin Build-Out 100 · Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Compared against 0522.HK on the nightly bakes; the Peers tab ranks the cohort on the Closelooknet scores where it exists.

Company snapshot — ASM Pacific Technology Ltd

0522.HK in five paragraphs: what it makes and sells, where it sits in the Closelooknet stack, who it is priced against, why we track it, what we watch. Research diary, not advice.

What it does
ASMPT designs and builds machines used to assemble semiconductor and electronics packages. It runs two segments: Semiconductor Solutions, covering advanced packaging steps such as hybrid bonding, thermo-compression bonding and wire bonding, plus equipment for CMOS image sensors; and Surface Mount Technology Solutions, covering the printing, inspection and placement tools used to build circuit boards. It is headquartered in Singapore and listed in Hong Kong.
Where it sits in the stack
In our Rubin Build-Out 100 index, ASMPT sits in Layer 3, Assembly & Test, within the Advanced Packaging & Bonding sleeve — the group of tools that perform hybrid bonding and chiplet integration, the packaging step the build-out is often bottlenecked on. It is a supplier of the bonding and packaging tools that chipmakers and assembly houses buy to build advanced packages.
Who it is priced against
Closelooknet's peer group places it with the other packaging and bonding equipment names — Nordson, Hanmi Semicon, Kulicke and Soffa, BE Semiconductor Industries and LPKF Laser & Electronics — reflecting shared exposure to the same packaging bottleneck. The market also names Applied Materials as a competitor in advanced packaging tools.
Why Closelooknet tracks it
It holds a seat in our Rubin Build-Out 100 index and carries a Closelooknet score across several modules; momentum is its strongest module and quality its weakest.
What the diary watches
The diary watches how fast hybrid bonding and chiplet packaging orders move from qualification to volume, since that is the bottleneck this sleeve is built to track.

ASM Pacific Technology Ltd (0522.HK) trades on the HK exchange in Singapore/HK, classified under Technology, and sits in Layer 3 of the build-out stack. Constituent of Rubin Build-Out 100.

The Closelooknet company score reads 38/100 composite (momentum 17, quality 29, valuation 44) across 7 modules — the full breakdown, chart structure and analog history load live above.

Written from the company’s public profile and Closelooknet’s own readings, 2026-09-17. Descriptive, refreshed with the registry; corrections welcome via the imprint. closelook.net is an investment research diary — market structure, index membership and scores are our own readings, not investment advice. Related: index compare · sector dispersion · scanner.

Dividends and capital return trailing yield 1.40%, semi-annual · last 0.97 HKD on 2026-08-11

Dividends and capital return

What 0522.HK pays out and buys back — distributions read from the price series, money terms from the filings.

  • Trailing 12 months 1.31 HKD per share · a 1.40% yield on the 2026-11-06 close 2 distributions, paid twice a year 2026-11-06
  • Change on the year +297.0% against the prior twelve months prior twelve months 0.33 HKD per share
  • Last distribution 0.97 HKD per share as the price series records it, within days of the ex-date 2026-08-11
  • By calendar year 2024: 0.61 HKD (partial) · 2025: 0.33 HKD · 2026: 1.31 HKD to date first distribution recorded in the three-year window: 2024-05-13
  • Dividends paid, FY2025 242 m HKD 43% of earnings
  • Share count +0.4% in FY2025 111 m HKD of stock-based compensation in the year
  • Capital returned 242 m HKD in a year of negative free cash flow dividends and buybacks together

Per-share amounts are derived from the adjusted price series in the listing currency, so dates sit within days of the ex-date; filing figures come from the fundamentals feed for the last reported fiscal year. An investment diary, not a recommendation.

FAQ · from the current data · as of 2026-11-07

Quick answers

What is ASM Pacific Technology Ltd (0522.HK)?

ASM Pacific Technology Ltd trades as 0522.HK on the HK exchange (Singapore/HK) and is classified under Technology in the Closelooknet research universe, as of the registry build of 2026-11-07.

Is 0522.HK in a Closelooknet index?

Yes — ASM Pacific Technology Ltd is a constituent of Rubin Build-Out 100, as of 2026-11-07.

What is ASM Pacific Technology Ltd's Closelooknet composite score?

38 out of 100, with momentum 17, quality 29 and valuation 44 sub-scores, as of 2026-11-07. Scores are Closelooknet's own research readings, not ratings or investment advice.

Where does 0522.HK trade against its moving averages?

ASM Pacific Technology Ltd trades 37.0% below its 50-day and 36.8% below its 200-day moving average (25.1% below its 20-day). As of 2026-11-06 — a technical state from the nightly Closelooknet bake, not advice. The Technical tab carries the full row.

How is 0522.HK doing against its Closelooknet index?

Over the past month ASM Pacific Technology Ltd is −46.2% against −28.8% for the Rubin Build-Out 100 — 17.4 points behind its index, as of 2026-11-06. Its Advanced Packaging & Bonding sleeve is −29.3% over the same month. The “Versus its index” table on this page carries the day, the week and the month for the name, its sleeve and the index.

How does ASM Pacific Technology Ltd compare with its peers?

Against its peer group (Rubin Build-Out 100 · Advanced Packaging & Bonding), ASM Pacific Technology Ltd (0522.HK) sits 61.6% below its 52-week high, 37.0% below its 50-day average; Nordson Corporation (NDSN) is 8.4% below, Hanmi Semicon (042700.KS) is 62.1% below, BE Semiconductor Industries NV (BESI.AS) is 57.1% below, as of 2026-11-06. Put any of them next to 0522.HK in the chart grid (2×1 or 2×2) and the page lays the companies side by side: performance, trend, valuation, margins and our money-flow reading.

Where has Closelooknet written about ASM Pacific Technology Ltd?

ASM Pacific Technology Ltd appears in 2 Closelooknet pieces as of 2026-11-07, most recently Morning 10: Asia’s chip rally fades into the close: Kospi touches 7,171 and ends under 7,000, Nikkei −1.2% on a 153 yen — and Lenovo drops 6%, Z.ai 10% in Hong Kong (2026-09-08); Morning 10: Kospi jumps 4% on OpenAI’s new model: SK hynix +7%, Kioxia +9%, SoftBank +10% — while gold and bitcoin slide on the rate-hike odds (2026-09-07). The "Mentioned on Closelooknet" block on this page lists the long reads, the reference entries and the dailies that name it.

What does ASM Pacific Technology Ltd do?

ASMPT designs and builds machines used to assemble semiconductor and electronics packages. It runs two segments: Semiconductor Solutions, covering advanced packaging steps such as hybrid bonding, thermo-compression bonding and wire bonding, plus equipment for CMOS image sensors; and Surface Mount Technology Solutions, covering the printing, inspection and placement tools used to build circuit boards. It is headquartered in Singapore and listed in Hong Kong. Closelooknet's peer group places it with the other packaging and bonding equipment names — Nordson, Hanmi Semicon, Kulicke and Soffa, BE Semiconductor Industries and LPKF Laser & Electronics — reflecting shared exposure to the same packaging bottleneck. The market also names Applied Materials as a competitor in advanced packaging tools. (Company snapshot of 2026-09-17.)

Where does ASM Pacific Technology Ltd sit in the AI build-out?

In our Rubin Build-Out 100 index, ASMPT sits in Layer 3, Assembly & Test, within the Advanced Packaging & Bonding sleeve — the group of tools that perform hybrid bonding and chiplet integration, the packaging step the build-out is often bottlenecked on. It is a supplier of the bonding and packaging tools that chipmakers and assembly houses buy to build advanced packages. It holds a seat in our Rubin Build-Out 100 index and carries a Closelooknet score across several modules; momentum is its strongest module and quality its weakest. (Company snapshot of 2026-09-17.)

Does ASM Pacific Technology Ltd pay a dividend?

ASM Pacific Technology Ltd has paid 1.31 HKD per share over the last twelve months, paid twice a year, a trailing yield of 1.40% on the 2026-11-06 close; the last distribution recorded in the price series was 0.97 HKD on 2026-08-11. In fiscal 2025 the company paid 242 m HKD in dividends. The share count rose 0.4% over the fiscal year. As of 2026-11-06; the "Dividends and capital return" block on this page carries the lines.

What does this page show?

A live price chart with SMA overlays and drawing tools for 0522.HK, performance metrics, index-membership context and the Closelooknet structure read — an investment research diary view, not investment advice.

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Related in the Closelooknet universe

same Closelooknet index seat first, then Semiconductor Equipment & Materials. Scored names rank on their Closelooknet score; names without one rank on trend state — above or below their 50- and 200-day averages — never on a score they do not carry.