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TAISP · Index 2 of 4 · AI Build-Out Family · monthly cadence · 25 tickers · 5 layers

Taiwan AI Supply Pulse

Taiwan-listed companies must report monthly operating revenue by the 10th of the following month — a hard, audited number with no analyst-estimate noise. TAISP aggregates 25 names across five layers of the AI hardware chain (servers, packaging, foundry, substrates, cooling) into one 0-100 regime read. High score = the chain is shipping faster than its own history. Low score = ordering is cooling.

Composite 96 / 100 Accelerating
Data month July 2026
Snapshot taken Aug 16, 2026
Universe 25 Taiwan-listed tickers across 5 layers
Source TWSE Open-API (mandatory monthly revenue filings)
History · momentum Accelerating +37 pts recent

104 points · since 2017-12

Layer breakdown

Each layer is one stage of the chain. The score is the YoY revenue growth percentile-ranked against this layer's own rolling history. Weights reflect how directly each layer reads AI-server shipments — ODMs at 30% (closest to the GPU build), substrates and cooling smaller (further from the dollar print).

AI Server ODMs 100 30% weight
YoY: +68.5% MoM: +0.5%

Hon Hai, Quanta, Wiwynn, Wistron, Inventec, Gigabyte — assemble Nvidia/AMD GPU servers for hyperscalers.

OSAT / Test / Packaging 86 25% weight
YoY: +35.9% MoM: +9.0%

ASE, KYEC, Sigurd, ChipMOS, Powertech — back-end packaging, testing, assembly.

Foundry / Design / ASIC 100 20% weight
YoY: +99.3% MoM: +28.6%

TSMC, Global Unichip, Alchip, MediaTek — wafer fab, custom-ASIC design, edge silicon.

Substrate / PCB / CCL 100 15% weight
YoY: +72.2% MoM: +12.5%

Unimicron, Nan Ya PCB, Kinsus, Elite Material, ITEQ, Gold Circuit — ABF substrates + advanced PCB.

Cooling / Power / Components 98 10% weight
YoY: +47.6% MoM: +3.2%

Delta, Auras, AVC, Lite-On — power supplies + liquid-cooling for AI servers.

Per-ticker breakdown 24 tickers · sorted by layer

Ticker Company Layer Revenue (USD est) YoY MoM
2317.TW Hon Hai (Foxconn) AI Server ODMs $29.58B +54.2% +15.2%
2382.TW Quanta AI Server ODMs $11.45B +131.3% -4.9%
3231.TW Wistron AI Server ODMs $9.63B +60.8% -4.2%
6669.TW Wiwynn AI Server ODMs $3.68B +39.2% +5.7%
2356.TW Inventec AI Server ODMs $2.82B +65.7% -11.8%
2376.TW Gigabyte AI Server ODMs $1.38B +59.7% +3.1%
3711.TW ASE Technology OSAT / Test / Packaging $2.31B +43.2% +12.2%
6239.TW Powertech OSAT / Test / Packaging $258M +29.4% +8.5%
2449.TW KYEC OSAT / Test / Packaging $125M +36.7% +10.2%
8150.TW ChipMOS OSAT / Test / Packaging $88M +43.6% +11.2%
6257.TW Sigurd OSAT / Test / Packaging $63M +26.6% +2.8%
2330.TW TSMC Foundry / Design / ASIC $14.61B +44.7% +5.6%
2454.TW MediaTek Foundry / Design / ASIC $1.51B +12.2% -16.4%
3661.TW Alchip Foundry / Design / ASIC $232M +181.8% +108.1%
3443.TW Global Unichip Foundry / Design / ASIC $180M +158.4% +17.1%
2383.TW Elite Material Substrate / PCB / CCL $600M +129.4% +8.3%
3037.TW Unimicron Substrate / PCB / CCL $508M +43.7% +9.1%
2368.TW Gold Circuit Substrate / PCB / CCL $313M +77.4% +21.3%
8046.TW Nan Ya PCB Substrate / PCB / CCL $170M +50.2% +16.1%
6213.TW ITEQ Substrate / PCB / CCL $148M +96.9% +12.7%
3189.TW Kinsus Substrate / PCB / CCL $142M +35.9% +7.7%
2308.TW Delta Electronics Cooling / Power / Components $2.10B +47.7% +2.2%
2301.TW Lite-On Cooling / Power / Components $594M +37.6% +1.9%
3017.TW AVC Cooling / Power / Components $581M +57.4% +5.5%

Equity Gap · TAISP vs Taiwan AI Basket Diverges 1-3M ahead

TAISP composite reads what's already shipped (revenue). The 25-stock equity basket reads what the market expects to ship next (price). When the index rises while the basket lags, the chain is delivering ahead of market consensus — historically a constructive setup for the broader AI capex thesis.

Basket 21d return +10.8% Equal-weighted across 21 tickers with available Lake prices
TAISP composite (this month) 96 Compared to history once ≥3 months accumulated
Equity Gap pending Needs ≥3 monthly snapshots — first read expected mid-Aug 2026

AI Build-Out Index Family 4 indices · supply-side AI hardware tracking

CCST · TAISP · MHP · STP — four independent indices, each with its own data source, equity basket, and equity-gap signal. Read them together: when one moves before the others, that's the rotation signal. (Agentic-demand-side tracking lives in the separate Agentic Demand Index.)

80.8 / 100 Tight

AI Build-Out Index — equal-weighted average of the 4 live indices below (4 of 4 reporting). Each index counts once; one with no current reading drops out rather than being imputed.

Methodology

TAISP is the second of the Closelook AI Build-Out Index Family — a 4-index suite tracking the AI hardware supply chain (Compute Spot Tightness · Taiwan AI Supply Pulse · Memory/HBM Pulse · Semicap/Test Pulse). Each index has its own data sources, equity basket, and equity-gap signal. Closelook Agentic Usage Pulse (AUP), tracking demand-side AI adoption, is a separate standalone index in its own track.

Data comes from the TWSE Open-API monthly revenue feed (t187ap05_L). Taiwanese listed companies are legally required to report monthly operating revenue by the 10th of the following month. The TAISP worker scrapes on the 16th of each month — a safe buffer for late filers and data settlement.

Per layer: equal-weighted average year-over-year revenue growth across all tickers with a comparable prior-year same-month figure. Per layer score: percentile rank of that YoY against the layer's own rolling 24-month history. First few months use a deterministic heuristic until history accumulates.

Composite: layer-weighted sum (ODM 30%, OSAT 25%, foundry 20%, substrate 15%, cooling 10%). 70+ = chain accelerating, 40-70 = steady, below 40 = decelerating.

Index reading is a diary entry on our process. Closelook publishes research, not investment advice.