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Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight — 1d —
Cap-weighted — 1d —
Momentum (drift) — 1d —
Constituents — in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap; below ten names the cap is infeasible, so the sub-index is equal weight by construction) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
042700.KSHanmi SemiconductorKorea243500.00+1.46%+7.74%+22.55%-9.81%-18.01%+179.79%KRW
LPK.DELPKF Laser & ElectronicsEurope14.50-8.23%+17.89%+9.85%-30.95%+126.21%+107.44%EUR
KLICKulicke & SoffaUS88.47-2.62%+8.00%+4.66%-32.72%+28.59%+109.51%USD
0522.HKASMPTAsia-other166.00-2.92%+3.75%+1.90%-14.92%+61.79%+136.30%HKD
BESI.ASBESIEurope187.40-1.11%+3.25%-2.45%-32.81%+7.85%+49.19%EUR
NDSNNordsonUS323.26+0.57%+3.70%-3.09%+6.11%+19.35%+44.72%USD

FAQ · from the current data · as of 2026-09-24

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-09-24: leading — Hanmi Semiconductor (042700.KS) +22.55%; LPKF Laser & Electronics (LPK.DE) +9.85%; Kulicke & Soffa (KLIC) +4.66%. Lagging — Nordson (NDSN) -3.09%; BESI (BESI.AS) -2.45%; ASMPT (0522.HK) +1.90%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-09-24: Hanmi Semiconductor (042700.KS) +179.79%; ASMPT (0522.HK) +136.30%; Kulicke & Soffa (KLIC) +109.51%. Weakest: Nordson (NDSN) +44.72%; BESI (BESI.AS) +49.19%; LPKF Laser & Electronics (LPK.DE) +107.44%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.