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Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight — 1d —
Cap-weighted — 1d —
Momentum (drift) — 1d —
Constituents — in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap; below ten names the cap is infeasible, so the sub-index is equal weight by construction) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
LPK.DELPKF Laser & ElectronicsEurope13.00-2.26%-13.04%+12.07%-13.33%+5.69%+85.71%EUR
KLICKulicke & SoffaUS84.51-4.55%-11.00%+7.26%-14.65%+5.85%+112.68%USD
NDSNNordsonUS328.73-0.56%+0.32%+6.30%+12.06%+19.54%+43.54%USD
BESI.ASBESIEurope174.55+1.19%-0.68%-1.02%-22.59%-22.62%+23.96%EUR
0522.HKASMPTAsia-other149.10-5.87%-14.56%-3.37%-16.00%+18.80%+77.71%HKD
042700.KSHanmi SemiconductorKorea217500.00-5.02%-21.76%-13.17%+0.93%-14.20%+131.85%KRW

FAQ · from the current data · as of 2026-10-14

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-10-14: leading — LPKF Laser & Electronics (LPK.DE) +12.07%; Kulicke & Soffa (KLIC) +7.26%; Nordson (NDSN) +6.30%. Lagging — Hanmi Semiconductor (042700.KS) -13.17%; ASMPT (0522.HK) -3.37%; BESI (BESI.AS) -1.02%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-10-14: Hanmi Semiconductor (042700.KS) +131.85%; Kulicke & Soffa (KLIC) +112.68%; LPKF Laser & Electronics (LPK.DE) +85.71%. Weakest: BESI (BESI.AS) +23.96%; Nordson (NDSN) +43.54%; ASMPT (0522.HK) +77.71%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.