Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight 1d —
Cap-weighted 1d —
Momentum (drift) 1d —
Constituents in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap; below ten names the cap is infeasible, so the sub-index is equal weight by construction) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
042700.KSHanmi SemiconductorKorea250500.00+2.45%+17.33%+21.90%-7.22%-17.87%+182.02%KRW
NDSNNordsonUS313.94-0.90%-0.15%+1.70%+8.21%+15.58%+40.26%USD
0522.HKASMPTAsia-other169.00+4.71%+7.37%+1.68%-3.98%+52.12%+139.72%HKD
KLICKulicke & SoffaUS83.78+0.85%+7.36%-3.14%-18.37%+28.39%+122.39%USD
LPK.DELPKF Laser & ElectronicsEurope13.20-2.58%+0.76%-15.38%-42.11%+88.57%+71.43%EUR
BESI.ASBESIEurope188.95-3.20%-1.84%-16.02%-40.39%+8.50%+70.00%EUR

FAQ · from the current data · as of 2026-09-09

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-09-09: leading — Hanmi Semiconductor (042700.KS) +21.90%; Nordson (NDSN) +1.70%; ASMPT (0522.HK) +1.68%. Lagging — BESI (BESI.AS) -16.02%; LPKF Laser & Electronics (LPK.DE) -15.38%; Kulicke & Soffa (KLIC) -3.14%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-09-09: Hanmi Semiconductor (042700.KS) +182.02%; ASMPT (0522.HK) +139.72%; Kulicke & Soffa (KLIC) +122.39%. Weakest: Nordson (NDSN) +40.26%; BESI (BESI.AS) +70.00%; LPKF Laser & Electronics (LPK.DE) +71.43%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.