Rubin Build-Out 100 · Sector S7 · Layer 3 · Assembly & Test

Advanced Packaging & Bonding

CoWoS, hybrid bonding, and chiplet integration. The packaging bottleneck the Rubin thesis is built around.

Equal-weight 1d —
Cap-weighted 1d —
Momentum (drift) 1d —
Constituents in this sector

Composite Index — since inception (Dec 30, 2025)

Three weighting variants of the same constituent basket, rebased to 1,000 at inception. EW = ticker-equal-weight with quarterly drift. CW = cap-weighted (10% cap) with semi-annual rebalance. MW = drift-only (1/N at inception, market does the tilting between rebalances). Click a legend entry to toggle its line.

Constituents

Every Rubin constituent tagged into this sector. Click a row to open the stock detail page with full chart + Money-Temperature scoring.

Ticker Company Region Last 1d 1w 1m 3m 6m 1y CCY
042700.KSHanmi SemiconductorKorea210500.00-1.41%-5.18%+3.69%-30.07%-25.12%+142.98%KRW
NDSNNordsonUS317.49+0.27%-4.04%+2.20%+10.82%+13.33%+44.50%USD
0522.HKASMPTAsia-other162.00+2.92%-2.23%-2.17%-11.96%+49.45%+116.00%HKD
BESI.ASBESIEurope191.40-0.57%-1.85%-11.18%-31.86%+23.23%+73.75%EUR
LPK.DELPKF Laser & ElectronicsEurope13.00-0.76%-5.80%-14.19%-38.39%+81.56%+63.11%EUR
KLICKulicke & SoffaUS78.82-0.16%-6.91%-16.01%-26.69%+24.55%+119.46%USD

FAQ · from the current data · as of 2026-09-03

Advanced Packaging & Bonding — data Q&A

What is the Advanced Packaging & Bonding sub-index of the Rubin Build-Out 100?

6 constituents, listed across Europe, Asia-other, Korea, US, computed equal-weight, cap-weight and momentum-weight from the same basket and rebased to 1,000 at the index base date. Part of the Rubin Build-Out 100 — /indices/rubin/.

Which Advanced Packaging & Bonding constituents lead and lag over one month?

As of 2026-09-03: leading — Hanmi Semiconductor (042700.KS) +3.69%; Nordson (NDSN) +2.20%; ASMPT (0522.HK) -2.17%. Lagging — Kulicke & Soffa (KLIC) -16.01%; LPKF Laser & Electronics (LPK.DE) -14.19%; BESI (BESI.AS) -11.18%. Returns are close-to-close in each name's trading currency.

Which Advanced Packaging & Bonding names have done best over one year?

As of 2026-09-03: Hanmi Semiconductor (042700.KS) +142.98%; Kulicke & Soffa (KLIC) +119.46%; ASMPT (0522.HK) +116.00%. Weakest: Nordson (NDSN) +44.50%; LPKF Laser & Electronics (LPK.DE) +63.11%; BESI (BESI.AS) +73.75%.

How often does this sub-index update, and is it advice?

The worker recomputes the sub-index and every constituent's returns after each US close (prices converted to USD for the index level; per-name returns stay in local currency). This page is a data surface in an investment research diary — it describes constituents and returns, it recommends nothing.