What is Unimicron Technology Corp (3037.TW)?
Unimicron Technology Corp trades as 3037.TW on the TW exchange (Taiwan) and is classified under Technology in the Closelooknet research universe, as of the registry build of 2026-11-07.
Is 3037.TW in a Closelooknet index?
Yes — Unimicron Technology Corp is a constituent of Rubin Build-Out 100, as of 2026-11-07.
What is Unimicron Technology Corp's Closelooknet composite score?
48 out of 100, with momentum 38, quality 40 and valuation 32 sub-scores, as of 2026-11-07. Scores are Closelooknet's own research readings, not ratings or investment advice.
Where does 3037.TW trade against its moving averages?
Unimicron Technology Corp trades 31.8% below its 50-day and 10.2% below its 200-day moving average (30.8% below its 20-day). As of 2026-11-06 — a technical state from the nightly Closelooknet bake, not advice. The Technical tab carries the full row.
How is 3037.TW doing against its Closelooknet index?
Over the past month Unimicron Technology Corp is −44.5% against −28.8% for the Rubin Build-Out 100 — 15.7 points behind its index, as of 2026-11-06. Its Substrates & Interposers sleeve is −40.4% over the same month. The “Versus its index” table on this page carries the day, the week and the month for the name, its sleeve and the index.
How does Unimicron Technology Corp compare with its peers?
Against its peer group (Rubin Build-Out 100 · Substrates & Interposers), Unimicron Technology Corp (3037.TW) sits 48.8% below its 52-week high, 31.8% below its 50-day average; Corning Incorporated (GLW) is 61.9% below, AT & S Austria Technologie & Systemtechnik Aktiengesellschaft (ATS.VI) is 54.5% below, Intel Corporation (INTC) is 63.3% below, as of 2026-11-06. Put any of them next to 3037.TW in the chart grid (2×1 or 2×2) and the page lays the companies side by side: performance, trend, valuation, margins and our money-flow reading.
What does Unimicron Technology Corp do?
Unimicron makes printed circuit boards and the substrates that carry chips inside a package, including high-density interconnect boards, multi-layer and rigid-flex boards, and IC carriers such as FCBGA and FCCSP used to mount processors and memory. It also produces connectors and test-related equipment, alongside smaller unrelated businesses. The company is based in Taoyuan City, Taiwan. Closelooknet's peer group for this sleeve is built around substrate and interposer makers — Corning, AT & S, Intel, AGC and Ibiden — reflecting shared exposure to advanced packaging demand. (Company snapshot of 2026-09-17.)
Where does Unimicron Technology Corp sit in the AI build-out?
In our index, Unimicron sits in Layer 4, Infrastructure, within the Substrates & Interposers sleeve — the organic substrates and silicon interposers that connect a die to its package and board. It is a constraint on how densely a chip can be packaged, since substrate capacity and layer count limit how advanced a package can become. It is a constituent of the Rubin Build-Out 100 and carries a Closelooknet score, with momentum its strongest module and quality its weakest. (Company snapshot of 2026-09-17.)
Does Unimicron Technology Corp pay a dividend?
Unimicron Technology Corp has paid 1.98 TWD per share over the last twelve months, paid once a year, a trailing yield of 0.27% on the 2026-11-06 close; the last distribution recorded in the price series was 1.98 TWD on 2026-07-06. In fiscal 2025 the company paid 2.29 bn TWD in dividends. The share count fell 0.3% over the fiscal year. As of 2026-11-06; the "Dividends and capital return" block on this page carries the lines.
What does this page show?
A live price chart with SMA overlays and drawing tools for 3037.TW, performance metrics, index-membership context and the Closelooknet structure read — an investment research diary view, not investment advice.