Glossary term
3D Stacking
Vertical integration of chips into a stack rather than side by side; high-bandwidth memory (HBM) is the consumer example.
3D Stacking integrates chips vertically into a stack rather than laying them out side by side, shortening interconnect distances and boosting bandwidth and density. High-bandwidth memory (HBM) is the most visible example, stacking DRAM dies atop a logic base to feed AI accelerators. 3D stacking is widely seen as the future direction of advanced packaging as planar scaling slows. See Packaging Bottleneck 101.