Glossary term
Die
A single piece of silicon containing a chip's circuitry, cut from a larger wafer; the unit yield is measured against.
A Die is a single piece of silicon containing a chip's complete circuitry, cut from a larger processed wafer. The number of good dies per wafer determines yield and therefore unit economics, since larger dies fit fewer per wafer and are more likely to contain a fatal defect. The push toward chiplets is partly a response to the yield penalty of large monolithic dies. See Foundry Economics 101.