Glossary term
Chiplet
A modular chip design connecting multiple smaller dies in one package; lowers yield risk at the cost of integration complexity.
A Chiplet is a modular chip design that connects multiple smaller dies within a single package rather than fabricating one large monolithic die. Smaller dies yield better, so chiplet designs lower manufacturing risk while raising packaging and interconnect complexity. AMD pioneered the approach commercially, and Intel and increasingly NVIDIA have adopted it for high-end products. See Packaging Bottleneck 101.