Glossary term
Advanced Packaging
Umbrella term for techniques like CoWoS, chiplets, and 3D stacking that integrate multiple dies into one package; a primary AI supply constraint.
Advanced Packaging is the umbrella term for techniques — CoWoS, chiplets, 3D stacking — that integrate multiple dies into a single high-performance package. It has become a primary bottleneck in the AI build-out because packaging capacity, not raw wafer supply, gates how many high-end accelerators can ship. TSMC's CoWoS capacity is the most-watched constraint in this layer. See Packaging Bottleneck 101.